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Cutting Fluid for Wafer

Inorganic material (silicon, quartz, sapphire, gallium / arsenic) cutting fluid is unlike the normal coolant fluid used in metal cutting machining that use wire sawing methods, SiC slurry maintains an excellent proper viscosity, phase separation and sedimentation prevention of the compressed material, depending on the type and characteristics, as there are many different kinds available.

Product Name: DWF-722

DWF-722 is water based cutting fluid used for Diamond Wire Sawing of solar cell wafers ingot.  The main ingredient is Nonionic surfactant of Polyoxyalkyene Glycol Nonionic Surfactant. The produce is very good in providing an excellent lubrication, cooling, wetting, rust resistance and holding up under extreme pressure . Use this with a mixture of 5% diluted with ion exchange water. This cutting fluid can be reused over again, reducing the wafer manufacturing cost if an installation of removal system of silicon fine powder which is used during sawing.

Item

Specification

Remarks

Main component

Polyoxyalkyene Glycol

FT-IR spectrometer

Appearance

Yellowish Liquid

Visual test

Specific Gravity (at 20)

1.03~1.04

Hydrometer

Fisher Scientific

pH (at 20)

10.0~11.0

pH meter

Orion 520A

Solubility (Water)

Complete (Miscible)

Visual test

Viscosity ( cps at 25)

3~7

Remark)1

CODMn(/, 5% Dilution)

7,000~8,000

Manganese Method