JINBO

Development of tailor made products

Product Name: SOLUBE

SOLUBE P-783 and D-775 is a water based cutting fluid used in the wire sawing of semiconductor wafer ingots and solar cell wafers. The main ingredients are MPG(Monopropylene Glycol) and

DEG(Diethylene Glycol). This product is proven its excellence in lubricity, dispersion, wire adhesion and cleaning.  When SOLUBE P-783 is compared to D-775 in the environmental aspect, the Chemical Oxygen Demand (COD) is lower in characteristics.

JINBO: 82-10-3569-3579    Fax: 82-54-332-3588  

ICT: 82-10-9284-3578   Email: jinbo357@naver.com

Solar Cell Related

Item

Application

Cutting material

* Silicon Ingot for semiconductor wafer

* Silicon Ingot for solar cell wafer

* Silicon and quartz for semiconductor parts

* Ga/As wafer for LED Red Color light emitting

Wire Size ()

There are 0.12, 0.14, 0.16, 0.20 size, generally using 0.14mm for solar cell wafer sawing.

SiC Powder (mesh)

There are #800, #1000, #1200, #1500, different depends on the sawing equipment manufacturer and model, generally using #1000, #1500 mesh.

Item

P-783

D-775

Remarks

Main component

MPG

DEG

FT-IR spectrometer

Appearance

Clear Liquid

Clear Liquid

Visual test

Specific Gravity (at 20)

1.04~1.05

1.11~1.12

Hydrometer

Fisher Scientific

pH ( at 20)

6.0~7.0

8.0~9.0

pH meter

Orion 520A

Viscosity ( cps at 20)

25~30

25~30

Remark)1

Surface Tension ( mN/m at 25)

35~40

35~40

Surface Tension

Meter

Inorganic material (silicon, quartz, sapphire, gallium / arsenic) cutting fluid is unlike the normal coolant fluid used in metal cutting machining that use wire sawing methods, SiC slurry maintains an excellent proper viscosity, phase separation and sedimentation prevention of the compressed material, depending on the type and characteristics, as there are many different kinds available.