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Solar Cell Related

Inorganic material (silicon, quartz, sapphire, gallium / arsenic) cutting fluid is unlike normal coolant fluid used in metal cutting machining which use wire sawing methods. SiC slurry maintains an excellent proper viscosity, phase separation and sedimentation prevention of the compressed material, depending on the type and characteristics, as there are many different kinds available.

Wafer-machine cutting oil and/or water based fluids provided a metalworking coolant as well as lubrication, stands up to extreme pressures and provides anti-corrosion properties as required. This usage is for semiconductors, solar cells, LED (Light Emitting Diode) and others items depending on the material type and characteristics of Ingot material.

In the domestic semiconductor business, 6 inch and 8 inch silicon ingots use oil base product; 12 inch use a water based. Water base is also used for 125 × 125 , 156 × 156 ingots in the production of solar cell wafers.

After the wire sawing process of semiconductor wafers, there may be wafer surface defects or contamination present, even when using oil base products.  Available to correct these defects is with the lapping and polishing process. Unlike solar cell wafer, after wire sawing, the process of cleaning during the wafer manufacturing is already complete, because of the water base ability to clean during processing.

The current method of wire sawing wafers for solar cell is to use water-based cutting fluids with the  addition of Silicon Carbide (SiC) powders to make slurry and the slurry injection into the wire cutting of ingots. In recent years the process is getting away from use of SiC powder and trying the use of the  diamond wire process that is plated with nickel (Ni).

Compare to wire sawing, even though this method creates rough surfaces of the wafer, but the electrical properties of solar cells has no significant effect. In consideration of the cutting fluid used undiluted, Sic powder costs and waste slurry disposal cost, Diamond wire cost is expensive but when using diluted to about 5% cutting fluid, and reuse of the cutting fluid after remove of the silicon fine powder has occurred, it has many advantages and greatly reduces manufacturing costs.

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