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Adhesive for Wafer Polishing

SPA-140 ̾ ϴ Lapping, Annealing Wafer Back Side Spin ϰ 100 dz ˷̳ Plate (Block) ÷ 80 ϰ 1 Diamond Slurry Polishing(DMP), 2 Colloidal Silica Polishing(CMP) Wafer ˷̳ Plate , Polishing Ϸ 100 ~ 120 Wafer Ż ϴ.   SPA-140H SPA-140 ȭ ϸ, Ȥ CMP и Ѵ, Blue 100 ̻ µ ǿ Ż ʾ Baking Wafer Edge Ǿ ĺ Ͽ ǰ ϴ׸, Wafer ý Leveling ϴ.      

ǰ: SPA-140, SPA-140H

SPA-140

SPA-140H

ּ

Natural Resin

Natural Resin Ester

 

ܰ

Yellowish Liquid

Blue Viscous Liquid

Ȱ˻

ȿ (%)

40 0.5

40 0.5

For 3hr at 100

(cps at 20)

4 ~ 8

5~10

)1

(at 20)

0.87 ~0.89

0.87 ~0.89

Hydrometer

Fisher Scientific

(mgKOH/g)

65 ~ 70

70~75

 

ȭ ()

75 ~ 80

85~90

Ring&Ball Method

2-propanol(IPA)

2-propanol(IPA)

 

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