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   : 054-336-3578    Fax: 054-332-3588   : 010-9284-3578  

Email: jinbo357@naver.com

Wafer laser sawingϿ chip ϴ ܰ ϴ ǰ wafer β β laser sawing ִ Ѱ谡 ֱ pattern Ǿ ִ 300 wafer ޸ grinder 1 70~100 Ƴ 2 ǥ roughness ϴ wafer back polishing colloidal silica slurry particle size 30~40nm ̴..

Slurry for Back Polishing
ǰ: JINSOL BPS-215

ʼ 20 Ͽ ϸ, Ǿ ޶ ų colloidal silica particle ʴ´.

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Colloidal Silica

 

Milky White Liquid

Ȱ˻

pH (at 20)

11.0~12.0

pH meter

Orion 520A

(at 20)

1.09~1.12

Hydrometer Fisher Scientific

(cps at 20)

2~5

)1

񼮺

20

 

)1: Brookfiled Viscometer (DV-+Pro, Spindle No. 1, 50rpm)